Soldering a CubeNode onto a PCB

To solder a CubeNode onto a PCB, you can do the following:

1. Prepare "no clean" soldering paste to remove the need for post-soldering PCB cleaning.

2. Prepare a convention-type soldering oven. This allows for more precise temperature control compared to an infrared-type radiation oven.

3. Configure the oven settings.

• Take into account the following for the final soldering temperature:

  • Soldering paste type

  • Baseboard size, thickness, and material properties

• Do not exceed the peak temperature of the recommended soldering profile.

• Do not use a damp heat process during the soldering.

1. Bake the PCB.

2. Preheat the PCB to remove all the residual humidity using the following parameters:

   • Temperature rise rate: Max 3 °C/s

   • Time: 60 ~ 120 s

   • End temperature: 150 ~ 200 °C

• Insufficient preheating causes large solder balls to be formed.

• Excessive preheating can lead to both fine and large solder balls clustering.

1. Perform the heating-flow to the PCB with the following parameters:

• Time limit above 217 °C liquidus temperature: 40 ~ 100s

• Peak reflow temperature: 245 °C

Avoid sudden temperature increases to prevent solder paste slump.

1. Perform a controlled cooling process to cool the PCB with the following parameters:

   • Temperature fall rate: Max 4 °C/s

A controlled cooling process prevents the solder from becoming brittle.

1. It is recommended to conduct an optical inspection after the soldering.

2. PCB cleaning is recommended if a soldering paste other than "no-clean" was used.

Do not clean the PCB with the following:

• Water (may cause short-circuits)

• Alcohol or organic solvent (may leave inaccessible residues)

• Ultrasonic cleaner (may cause permanent damage)