Specifications

The CubeNode provides a platform to develop, create, test, and refine components such as navigation systems, communication modules, sensors, payloads, and more.

Depending on the CubeNode version, some features may be unavailable.

The CubeNode should undergo reflow soldering only once. For a two-sided assembly, ensure the device is soldered during the second pass through the line. If it is unable to run through the second pass, use reflow-safe underfill. Failure to comply may result in permanent damage to the device.

The following lists the CubeNode specification.

Microcontroller (Dual-Core)

32-bit Arm® Cortex®-M7 core

  • Double precision FPU

  • L1 cache: 16 Kbytes of data cache and 16 Kbytes of instruction cache

  • Frequency: Up to 480 MHz

  • Memory Protection Unit (MPU)

  • 1027 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1) DSP instructions

32-bit Arm® 32-bit Cortex®-M4 core

  • FPU

  • Adaptive real-time accelerator for internal Flash memory and external memory

  • Frequency: Up to 240 MHz

  • MPU

  • 300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1) DSP instructions

Memory

  • 2 Mbytes of Flash memory with read / write support

  • 1 Mbyte of RAM

    • 192 Kbytes of TCM RAM (including 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of SRAM, and 4 Kbytes of backup SRAM

  • Cyclic redundancy check (CRC) calculation unit

Security

  • Read-out protection (ROP)

  • Proprietary code read-out protection (PC-ROP)

  • Active tamper

  • Secure firmware upgrade support

  • Secure access mode

Communication Peripherals

  • 2 x CAN FD

  • 1 x USB

  • 1 x SDMMC

  • 1 x 10/100BaseT Ethernet

  • Up to 7 UART / USARTs

  • Up to 4 SPIs

  • Up to 3 I2Cs

  • Up to 24 Timer Channels

  • Up to 17 Analog Channels

  • Up to 66 General Purpose I/Os

ParameterDescription

Standard Operating Voltage

4.5V ~ 5.5V

Operating Ambient Temperature

-40°C ~ 85°C

Operating Junction Temperature

-40°C ~ 125°C

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