The CubeNode provides a platform to develop, create, test, and refine components such as navigation systems, communication modules, sensors, payloads, and more.
Depending on the CubeNode version, some features may be unavailable.
The CubeNode should undergo reflow soldering only once. For a two-sided assembly, ensure the device is soldered during the second pass through the line. If it is unable to run through the second pass, use reflow-safe underfill. Failure to comply may result in permanent damage to the device.
The following lists the CubeNode specification.
Double precision FPU
L1 cache: 16 Kbytes of data cache and 16 Kbytes of instruction cache
Frequency: Up to 480 MHz
Memory Protection Unit (MPU)
1027 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1) DSP instructions
FPU
Adaptive real-time accelerator for internal Flash memory and external memory
Frequency: Up to 240 MHz
MPU
300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1) DSP instructions
2 Mbytes of Flash memory with read / write support
1 Mbyte of RAM
192 Kbytes of TCM RAM (including 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of SRAM, and 4 Kbytes of backup SRAM
Cyclic redundancy check (CRC) calculation unit
Read-out protection (ROP)
Proprietary code read-out protection (PC-ROP)
Active tamper
Secure firmware upgrade support
Secure access mode
2 x CAN FD
1 x USB
1 x SDMMC
1 x 10/100BaseT Ethernet
Up to 7 UART / USARTs
Up to 4 SPIs
Up to 3 I2Cs
Up to 24 Timer Channels
Up to 17 Analog Channels
Up to 66 General Purpose I/O
Standard Operating Voltage
4.5V ~ 5.5V
Standard Operating Voltage (HV_IN pin)
5.5V ~ 30V
Operating Ambient Temperature
-40°C ~ 85°C
Operating Junction Temperature
-40°C ~ 125°C
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